Đà Nẵng is positioning itself as one of Việt Nam’s top three semiconductor and microchip hubs by 2030, aligning with the national semiconductor development strategy to 2050. A major step forward is the launch of the VSAP LAB fab-lab project at Đà Nẵng Software Park 2, with a total investment of VNĐ1.8 trillion (US$68.8 million). Covering 2,288 sq.m., it is expected to begin operations in late 2026 with a capacity of 10 million products annually. The facility will pioneer advanced packaging technologies such as RDL Fan-out, 2.5D, and 3D packaging—critical for AI chips, automotive applications, and next-generation electronics. The fab-lab adopts a public-private partnership model, integrating research, production, testing, training, and technology transfer. Local authorities have pledged strong support in infrastructure and talent development, with Đà Nẵng aiming to attract at least 5,000 skilled professionals, including 1,500 design engineers and 3,500 testing and packaging specialists by 2030. Universities are enhancing semiconductor-focused curricula, supported by cooperation with global partners and the National Innovation Centre. Incentives worth VNĐ873 billion ($33.2 million) are offered to attract experts and researchers. Currently, Đà Nẵng hosts about 10 semiconductor companies employing 550 engineers, setting a strong foundation for future growth. (ICE HO CHI MINH CITY)

Fonte notizia: Vietnam News